Advanced Semiconductor Packaging
Throughout this course, you will be introduced to Pathway for Assembly and Packaging technologies for 7-nanometer silicon feature sizes and beyond. The course will present the evolution and impact of packaging on product performance and innovation. Specifically, we highlight how packaging has enabled better products via the use of heterogeneous integration by improving the interconnects for thermal management and signal integrity.
Monthly Subscription Starting at AED 99 + VAT
- Level Foundation
- Duration 6 hours
- Course by Arizona State University
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Offered by
About
Throughout this course, you will be introduced to Pathway for Assembly and Packaging technologies for 7-nanometer silicon feature sizes and beyond. The course will present the evolution and impact of packaging on product performance and innovation. Specifically, we highlight how packaging has enabled better products via the use of heterogeneous integration by improving the interconnects for thermal management and signal integrity.Modules
Advanced Packaging Course Overview
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1
Videos
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2
Readings
1
Videos
- Welcome to Advanced Packaging
2
Readings
- Meet the Experts
- Reference Guide
Packaging Trends Part 1 Lesson
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1
Videos
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1
Readings
1
Videos
- Packaging Trends Part 1 Lecture
1
Readings
- Challenges and recent prospectives of 3D heterogeneous integration
End of Module Knowledge Check
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1
Assignment
1
Assignment
- Packaging Trends Part 1 Quiz
Packaging Trends Part 2 Lesson
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1
Videos
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1
Readings
1
Videos
- Packaging Trends Part 2 Lecture
1
Readings
- Future Challenges For Advanced Packaging
End of Module Knowledge Check
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1
Assignment
1
Assignment
- Packaging Trends Part 2 Quiz
Heterogeneous Integration Part 1 Lesson
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1
Videos
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1
Readings
1
Videos
- Heterogeneous Integration Part 1 Lecture
1
Readings
- Heterogeneous Integration and the Evolution of IC Packaging
End of Module Knowledge Check
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1
Assignment
1
Assignment
- Heterogeneous Integration Part 1 Quiz
Heterogeneous Integration Part 2 Lesson
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1
Videos
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1
Readings
1
Videos
- Heterogeneous Integration Part 2 Lecture
1
Readings
- Co-packaged datacenter optics: Opportunities and challenges
End of Module Knowledge Check
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1
Assignment
1
Assignment
- Heterogeneous Integration Part 2 Quiz
Advanced Packaging Exam
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1
Videos
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1
Assignment
1
Assignment
- Advanced Semiconductor Packaging Exam
1
Videos
- End of Course Summary
Auto Summary
Unlock the cutting-edge world of semiconductor technology with the "Advanced Semiconductor Packaging" course, tailored for science and engineering enthusiasts. Delve into the sophisticated realm of 7-nanometer silicon feature sizes and beyond, exploring the crucial role of packaging in enhancing product performance and driving innovation. Guided by expert instructors from Coursera, this foundational course takes you through the evolutionary journey of packaging technologies and their pivotal impact on thermal management and signal integrity. With a comprehensive 360-minute duration, you'll gain deep insights into how heterogeneous integration is revolutionizing interconnects and overall product efficiency. Flexible subscription options are available, including Starter and Professional plans, making it accessible for both budding engineers and seasoned professionals eager to expand their knowledge in semiconductor packaging. Enroll now to elevate your expertise and stay ahead in the dynamic field of semiconductor technology.
Terry Alford